Posted on: 2020-05-22

Job type: Permanent

Sector: Industry and Manufacturing

 
Sign up for job alerts

You will receive job alerts for:

Please enter your email address.

This company is a global analog and digital semiconductor IC design and manufacturing company

- Driving next generation bump and W L C S P technologies for improved performance, cost reduction and reliability.

- Lead process development within sputter, plate, etch, thin-films and photo lithography.

- Further material road-maps in copper plating, polymer films, liquid/dry film resists, and ball place.

- Clean room time will be required to develop new processes for the next gen technologies.

- Working with internal and external customers on key issues resolution root cause analysis.

- Engaging with multiple internal and external stakeholders to guide and execute on technology road-maps to support future products

- Fluent English and report to HQ directly

- Driving next generation bump and W L C S P technologies for improved performance, cost reduction and reliability.

- Lead process development within sputter, plate, etch, thin-films and photo lithography.

- Further material road-maps in copper plating, polymer films, liquid/dry film resists, and ball place.

- Clean room time will be required to develop new processes for the next gen technologies.

- Working with internal and external customers on key issues resolution root cause analysis.

- Engaging with multiple internal and external stakeholders to guide and execute on technology road-maps to support future products

- Fluent English and report to HQ directly.

Please feel free to contact with me: +21-23217774 or Ian.Li@hudson.com
Send job by email

Apply for Bumping Expert Engineer
Reference: CN161770

Please complete all required fields marked *

*

*

*

*

*
Choose file

Issues applying with LinkedIn? Click here

MS Word, PDF, HTML and Txt formats.

*
I agree to Hudson Privacy Policy.